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TC74HCT7007AP/AF
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic
TC74HCT7007AP,TC74HCT7007AF
Hex Buffer
The TC74HCT7007A is a high speed CMOS BUFFER fabricated with silicon gate C2MOS technology. It achieves the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. This device may be used as a level converter for interfacing TTL or NMOS to High Speed CMOS. The inputs are compatible with TTL, NMOS and CMOS output voltage levels. The internal circuit is composed of 4 stages including a buffer output, which provides high noise immunity and stable output. All inputs are equipped with protection circuits against static discharge or transient excess voltage.
TC74HCT7007AP
TC74HCT7007AF
Features
* * * * * * * * High speed: tpd = 11 ns (typ.) at VCC = 5 V Low power dissipation: ICC = 1 A (max) at Ta = 25C Compatible with TTL outputs: VIH = 2 V (min) VIL = 0.8 V (max) Wide interfacing ability: LSTTL, NMOS, CMOS Output drive capability: 10 LSTTL loads Symmetrical output impedance: |IOH| = IOL = 4 mA (min) Balanced propagation delays: tpLH tpHL Pin and function compatible with 74LS07 Weight DIP14-P-300-2.54 SOP14-P-300-1.27A : 0.96 g (typ.) : 0.18 g (typ.)
Pin Assignment
IEC Logic Symbol
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TC74HCT7007AP/AF
Truth Table
A L H Y L H
Absolute Maximum Ratings (Note 1)
Characteristics Supply voltage range DC input voltage DC output voltage Input diode current Output diode current DC output current DC VCC/ground current Power dissipation Storage temperature Symbol VCC VIN VOUT IIK IOK IOUT ICC PD Tstg Rating -0.5~7 -0.5~VCC + 0.5 -0.5~VCC + 0.5 20 20 25 50 500 (DIP) (Note 2)/180 (SOP) -65~150 Unit V V V mA mA mA mA mW C
Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = -40C~65C. From Ta = 65C to 85C a derating factor of -10 mW/C shall be applied until 300 mW.
Operating Ranges (Note)
Characteristics Supply voltage Input voltage Output voltage Operating temperature Input rise and fall time Symbol VCC VIN VOUT Topr tr, tf Rating 4.5~5.5 0~VCC 0~VCC -40~85 0~500 Unit V V V C ns
Note:
The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND.
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Electrical Characteristics
DC Characteristics
Test Condition Characteristics High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Input leakage current Quiescent supply current Symbol VCC (V) IOH = -20 A VIN = VIH or IOH = -4 mA VIL IOL = 20 A VIN = VIH or IOL = 4 mA VIL VIN = VCC or GND VIN = VCC or GND Per input: VIN = 0.5 V or 2.4 V Other input: VCC or GND 4.5~ 5.5 4.5~ 5.5 4.5 4.5 4.5 4.5 5.5 5.5 5.5 Min 2.0 4.4 4.18 Ta = 25C Typ. 4.5 4.31 0.0 0.17 Max 0.8 0.1 0.26 0.1 1.0 2.0 Ta = -40~85C Min 2.0 4.4 4.13 Max 0.8 0.1 0.33 1.0 10.0 2.9 Unit
VIH VIL VOH
V V V
VOL IIN ICC IC
V A A mA
AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25C, input: tr = tf = 6 ns)
Characteristics Output transition time Symbol tTLH tTHL tpLH tpHL Test Condition Min Typ. 6 Max 12 Unit ns
Propagation delay time
11
17
ns
AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns)
Test Condition Characteristics Symbol tTLH tTHL tpLH tpHL CIN CPD (Note) VCC (V) 4.5 5.5 4.5 5.5 Min Ta = 25C Typ. 8 7 14 12 5 22 Max 15 14 23 21 10 Ta = -40~85C Min Max 19 18 28 26 10 Unit
Output transition time Propagation delay time Input capacitance Power dissipation capacitance
ns
ns pF pF
Note:
CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPDVCCfIN + ICC/6 (per gate)
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Package Dimensions
Weight: 0.96 g (typ.)
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Package Dimensions
Weight: 0.18 g (typ.)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Product names mentioned herein may be trademarks of their respective companies. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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